February 20, 2026 9:20 PM
Prime Minister Modi to Join Groundbreaking of HCL-Foxconn Semiconductor JV
Prime Minister Modi will participate in the groundbreaking ceremony of the HCL-Foxconn joint venture semiconductor project — India Chip Pvt. Ltd. — in the Yamuna Expressway Industrial Development Authority (YEIDA), Uttar Pradesh, on February 21, 2026, at around 5 PM via video conferencing. The Prime Minister will also address the gathering on the occasion. The establishment of the HCL-Foxconn Outsourced Semiconductor Assembly and Test (OSAT) facility marks a significant milestone in India...